发明名称 ELECTRONIC PARTS REPAIR EQUIPMENT AND ELECTRONIC PARTS REPAIRING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide electronic parts repair equipment and an electronic parts repairing method that can easily repair minute electronic parts that are highly densely mounted using laser heating. <P>SOLUTION: At an tip part of a heating and suction head 35 of the electronic parts repair equipment, there is prepared an optical waveguide 40 for setting an irradiation direction of a laser beam 21 transmitted from within an optical fiber 31 to surely irradiate the laser beam to a target part to be repaired. The optical waveguide 40 is constructed such that the laser beam is emitted from the tip surface 35a that is in contact with the target repaired part at the tip part. Further, there is prepared a suction hole 23 inside the optical waveguide 40 that extends in parallel with the transmission direction of the laser beam, and one opening of the suction hole 23 is prepared at the tip surface 35a. The other opening of the suction hole 23 is in contact with a vacuum suction hose 36, and it is so constructed that the internal cavity of the suction hole 23 becomes vacuum by a vacuum source. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009164310(A) 申请公布日期 2009.07.23
申请号 JP20070341456 申请日期 2007.12.28
申请人 SHARP CORP 发明人 YAMADA TAKAYUKI
分类号 H05K3/34;B23K26/00;B23K26/06;B23K101/42 主分类号 H05K3/34
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