发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To perform a uniform and efficient treatment by a substrate treatment apparatus targeting a large-area substrate treatment using a treating liquid. <P>SOLUTION: The substrate treatment apparatus, which treats a substrate mounted on a conveying table while conveying the substrate, includes: a suction unit for sucking the treating liquid; and a blocking unit for blocking the treating liquid in this order from upstream to downstream in the conveyance direction of the substrate. Further, a cleaning unit having a brush for brushing a surface of the substrate can be disposed upstream. The cleaning unit comprises a plurality of brush units whose positions can be adjusted independently of each other. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009164346(A) 申请公布日期 2009.07.23
申请号 JP20080000658 申请日期 2008.01.07
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 YOSHIZAWA CHIE;TAKAHARA YOICHI;TANAKA TSUTOMU;MORIGUCHI YOSHIHIRO;KAMAISHI KOSEI
分类号 H01L21/304;B65G49/02;B65G49/04;G02F1/13;G02F1/1333;H01L21/306 主分类号 H01L21/304
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