| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology capable of protecting the surface of a semiconductor device from a cut end of a wire by using a protective film. <P>SOLUTION: In the semiconductor device 2, on the surface of an insulating film 24 on the side where the extension part 14e of a wire 14 connected and fixed to a pad 16 is pulled from the pad 16, the protective film 18 is formed, the height of which is lowered as getting closer to the pad 16. When the extension part 14e is pulled from the pad 16, the cut end 14f never touches the insulating film 24. Formation of a scratching mark on the insulating film 24 can be prevented. Also, the extension part 14e never touches a restricted range of the protective film 18. Damage to the protective film 18 can be prevented. In the present invention, the surface of the semiconductor device 2 can be protected from the cut end 14f of the wire 14 using the undamaged protective film 18. Thereby, the pad 16 can be scaled down, and the effective area 10 for manufacturing the semiconductor structures can be expanded. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
