| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip module that achieves high performance and miniaturization. SOLUTION: A first semiconductor chip is laid on a surface of a mounting substrate having a plurality of electrodes formed thereon. A second semiconductor chip and a third semiconductor chip having a plurality of bonding pads and backsides in respective principal surface peripheral parts thereof are mounted on a surface of the first semiconductor chip. Bonding pads existing on the side of a first side of the first semiconductor chip, out of bonding pads of the second semiconductor chip are electrically connected to first electrodes on the mounting substrate through first bonding wires, and bonding pads existing on the side of a second side of the first semiconductor chip, out of bonding pads of the second semiconductor chip are electrically connected to second electrodes on the mounting substrate through second bonding wires and the third semiconductor chip. The first, second and third semiconductor chips on the mounting substrate are sealed by a resin seal. COPYRIGHT: (C)2009,JPO&INPIT |
