| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve strength, prevent short-circuit, improve mounting property and suppress deformation in such a semiconductor device on the lower-layer side that constitutes a laminated semiconductor package, and to provide a manufacturing method thereof. SOLUTION: The semiconductor device is provided with: a wire section 13s which is formed at the upper central area of a resin mold and of which the thickness from the bottom of the resin mold is made larger than a height of a loop of a bonding wire; a connection terminal section 13t which is formed around the wire section 13s and of which the thickness from the bottom of the resin mold is made smaller than that of the wire section 13s; and a reinforced surrounding wall section 13w which is formed in the periphery of the connection terminal section 13t and of which the thickness from the bottom of the resin mold is made the same as that of the wire section 13s. COPYRIGHT: (C)2009,JPO&INPIT
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