| 摘要 |
A manufacture method of semiconductor package with an antenna includes: providing a substrate with a first surface and an opposite second surface, wherein the first surface has a predetermined circuit; arranging a functional element on the first surface and electrically connecting the functional element with the predetermined circuit of the substrate; encapsulating the functional element and a portion of the first surface of the substrate by an encapsulating body; and printing an antenna electrically connected with the predetermined circuit on the surface of the encapsulating body. A semiconductor package with an antenna is also disclosed.
|
