发明名称 SEMICONDUCTOR CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To prevent concentration of current to one semiconductor package due to a difference in reactance of the semiconductor packages connected in parallel and to prevent thermal destruction of the semiconductor package. <P>SOLUTION: Respective series connection terminals P3 and N3 of a smoothing capacitor 7 are connected to respective DC connection terminals P1, P2, N1 and N2 of the semiconductor packages 1 and 2 by first and second conductors 8 and 9 whose lengths are equal. The AC connection terminals AC1 and AC2 of the semiconductor packages 1 and 2 are connected to an AC output terminal ACO by a third conductor whose both legs project at right angles from an intermediate part at the center of a U-shaped part connected to the AC connection terminals AC1 and AC2 and which bend at the right angles from the projected parts, bend at the right angles in a direction opposite to the projected parts, bend at the right angles much more and reach positions of the AC output terminals. Distances between the center of the U-shaped part of the third conductor and parts bent at the right angles from the projected parts are detached. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009165278(A) 申请公布日期 2009.07.23
申请号 JP20080000914 申请日期 2008.01.08
申请人 MEIDENSHA CORP 发明人 KUSUMOTO HIDENOBU
分类号 H02M7/48;H01L25/07;H01L25/18 主分类号 H02M7/48
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