| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a laminate structure of semiconductor device which is made more compact and thinner. <P>SOLUTION: The laminate structure of semiconductor device which is made more compact and thinner is achieved by arranging the pads 4d of a semiconductor chip 2d on the top stage on the side of a base substrate 1, and connecting the pads 4d of a semiconductor chip 2d with the electrodes 8d of a base substrate 1 by means of a flexible substrate 5 mounting a functional component 7. Furthermore, an interposer substrate 25 is used in place of the flexible substrate 5, and a laminate structure of semiconductor device which is made more compact and thinner is achieved. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
