| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board capable of eliminating unwanted plating by forming non-through-holes of required depths without removing plating and without leaving any processing liquid in the non-through-holes, and to provide its manufacturing method. <P>SOLUTION: A substrate 22 has a first surface 22a and a second surface 22b opposite to the first surface. At least one wiring layer 24-2 is formed between the first surface 22a and the second surface 22b. At least one internally-plated (28-2) non-through-hole 26-2 is formed so deeply from the first surface to touch the wiring layer. A through-hole 30-1 is formed to connect the bottom of the non-through hole 26-2 to the second surface of the substrate. The diameter of the through-hole is smaller than the inner diameter of the internally-plated (28-2) non-through hole. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
