| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize an electronic component having a passive element formed on a multilayer ceramic substrate having a through electrode. SOLUTION: The electronic component includes: the multilayer ceramic substrate 20 that has the through electrode 12 formed therein, and has the passive element provided on the upper face thereof; an insulating film 26 that is provided on the multilayer ceramic substrate 20, and has an opening above the through electrode 12; a first connecting terminal 92 that is provided on the insulating film 26 so as to cover the opening, and is electrically connected to the through electrode 12; and a second connecting terminal 90 that is provided on a region of the insulating film other than the opening region. COPYRIGHT: (C)2009,JPO&INPIT |
