| 摘要 |
First, a structure is fabricated by directly bonding a first base material and a second base material. The first base material has a recessed portion formed in a desired patterning layout on one surface thereof, and the bonding is performed in such a manner that the surface having the recessed portion of the first base material faces inward. Then, through holes are formed at desired positions in the structure in such a manner that the through holes pierce the structure in a direction of thickness thereof and communicate with the corresponding recessed portions. Further, an insulating layer is formed on the surface of the structure, and thereafter, a conductive material is filled into the through holes and the recessed portions.
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