发明名称 METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNECTION MEMBER
摘要 The invention relates to a method for making an electrically-conducting mechanical interconnection member (12), that comprises: a first phase of electrochemical deposition of a structure including a plurality of metal wires (2a) having a sub-micrometric diameter and protruding from the surface of a substrate (2) also made of metal; and a second phase for the controlled and partial dissolution of said wires in order to reduce the diameter thereof. The invention also relates to a method for making a mechanical and/or electric interconnection, that comprises the steps of: making two interconnection members according to the method mentioned above; and positioning the interconnection members face to face and pressing them against each other in order to carry out an interpenetration and an entanglement of the nanometric wires protruding from the surfaces of said members. The invention also relates to a three-dimensional electronic device including a stack of micro-electronic chips mechanically and electrically connected together by such interconnection members.
申请公布号 WO2009090349(A2) 申请公布日期 2009.07.23
申请号 WO2008FR01497 申请日期 2008.10.24
申请人 CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE;UNIVERSITE PAUL SABATIER;SIMON, PATRICE;TABERNA, PIERRE-LOUIS;LEBEY, THIERRY;CAMBRONNE, JEAN PASCAL;BLEY, VINCENT;LUAN, QUOC HUNG;TARASCON, JEAN MARIE 发明人 SIMON, PATRICE;TABERNA, PIERRE-LOUIS;LEBEY, THIERRY;CAMBRONNE, JEAN PASCAL;BLEY, VINCENT;LUAN, QUOC HUNG;TARASCON, JEAN MARIE
分类号 H01L23/48;H01L21/02;H01L21/60;H01L23/49;H01L25/065;H01R4/26 主分类号 H01L23/48
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