| 摘要 |
<p>A CMP pad conditioner is used in global planar izat ion of wafers for high integration of semiconductor devices. The CMP pad conditioner includes a frame fixing abrasive particles to prevent the abrasive particles from being detached from the conditioner, the abrasive particles protruding from the fixing frame at a predetermined height, and a molding material fixing the fixing frame and the abrasive materials to each other. The abrasive particles are placed inside the through-holes, by one abrasive particle in one through-hole, and each of the abrasive particles is partially exposed from the underside surface of the fixing frame. The conditioner can ensure stability of prevent abrasive particles from being detached, realize uniform dressing, excellent dressing efficiency and excellent performance reproducibility, and remarkably remove the probability of scratches.</p> |
