| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a side-view type LED lamp capable of increasing the strength of solder bonding to a circuit board on which the LED lamp is mounted, capable of making the high bonding strength available in a wide range from comparatively large size lamps to small size lamps, the LED lamp enabling low-cost manufacturing. <P>SOLUTION: An LED element mounting substrate 2 of a side view type LED lamp 1 is equipped with electrode portions 4d and 5d that extend into the insulating substrate 6 oppositely towards each other from each of the electrodes 4 and 5 provided on both ends of an insulating substrate 6. When the side-view type LED lamp 1 is mounted on a circuit board 7, the end surface 4e of the electrode portion 4d and the end surface 5e of the electrode portion 5d contribute to the increase of the strength of solder bonding. <P>COPYRIGHT: (C)2009,JPO&INPIT |
