发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board allowing circuit patterns to be formed on both surfaces of the printed circuit board by processes different from each other; and to provide a method of manufacturing the same. <P>SOLUTION: The method of manufacturing the printed circuit board includes steps of: forming a first protective layer over one surface of a core substrate; forming a first circuit pattern over the other surface of the core substrate by a first process; removing the first protective layer; forming a second protective layer over the other surface of the core substrate; and forming a second circuit pattern over the one surface of the core substrate by a second process. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009164557(A) 申请公布日期 2009.07.23
申请号 JP20080155567 申请日期 2008.06.13
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM JOON-SUNG;YOO JE-GWANG;RYU CHANG-SUP
分类号 H05K3/06 主分类号 H05K3/06
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