发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board allowing circuit patterns to be formed on both surfaces of the printed circuit board by processes different from each other; and to provide a method of manufacturing the same. <P>SOLUTION: The method of manufacturing the printed circuit board includes steps of: forming a first protective layer over one surface of a core substrate; forming a first circuit pattern over the other surface of the core substrate by a first process; removing the first protective layer; forming a second protective layer over the other surface of the core substrate; and forming a second circuit pattern over the one surface of the core substrate by a second process. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
申请公布号 |
JP2009164557(A) |
申请公布日期 |
2009.07.23 |
申请号 |
JP20080155567 |
申请日期 |
2008.06.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM JOON-SUNG;YOO JE-GWANG;RYU CHANG-SUP |
分类号 |
H05K3/06 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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