| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board having good humidity resistance reliability by the cured resin system of a single epoxy resin, and to provide a circuit board having high heat dissipation characteristics by highly filling up with inorganic filler. SOLUTION: A metal base circuit board 5 includes: a metal base 1; an insulating layer 2 laminated on the metal base; a circuit foil 3 laminated locally on the insulating layer; and an insulating coating resin 4 laminated in the exposed surface of the circuit foil and the insulating layer, wherein the insulating coating layer is preferable to contain the inorganic filler more than 50 weight%. More preferably, the inorganic filler contains coarse powder of which the maximum diameter is 100μm or less, the average particle diameter is 5μm or more and 50μm or less, containing 50% by volume or more of single particles whose particle diameter is 1μm or more and 12μm or less, and fine powder of which the average particle diameter is 0.2μm or more and 1.5μm or less, containing 70% by volume or less of particles whose particle diameter is 2.0μm or less. COPYRIGHT: (C)2009,JPO&INPIT
|
