| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element assembly having such a configuration and a structure tat a connection part is not damaged, or the like, when wire bonding for instance is executed to the connection part provided on an electrode pad part. SOLUTION: The light emitting element assembly has (A) a light-emitting element part 20 comprising a first laminate structure 25 constituted by laminating a plurality of compound semiconductor layers 21, 23 and 22; and (B) an electrode pad part 30, comprising a second laminate structure 35 for which a current blocking layer 31 constituted of a compound semiconductor is laminated further on laminate structures 121, 123 and 122, having the same configuration as the first laminate structure 25. The light-emitting element part 20 and the electrode pad part 30 are electrically connected by a conductive material layer 52. COPYRIGHT: (C)2009,JPO&INPIT
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