发明名称 METHOD OF INSPECTING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To achieve a new method of inspecting an electronic component with a depressurized cavity having a functional element disposed therein that easily inspects and checks the depressurizing sealing state of the cavity during a manufacturing process. SOLUTION: The method of inspecting the electronic component includes a first depressurized cavity C1 having a functional element 12 in the inside. In this case, second cavities C3, C4 depressurized in a depressurizing sealing process common to that of at least the first cavity C1 are previously formed, and the bending state of covering portions 32C, 33C for covering the second cavities C3, C4 is detected from the outside. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009164336(A) 申请公布日期 2009.07.23
申请号 JP20080000379 申请日期 2008.01.07
申请人 SEIKO EPSON CORP 发明人 MORI TAKASHI;SATO AKIRA
分类号 H01L21/66 主分类号 H01L21/66
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