| 摘要 |
PROBLEM TO BE SOLVED: To raise a connection reliability between a semiconductor chip and a circuit board. SOLUTION: The semiconductor chip 20 and the circuit board 30 are electrically connected with a terminal sheet 10 having terminal parts 12 penetrating through insulative resin sheets 11. The terminal parts 12 of the terminal sheet 10 have a constitution equipped with adhesive layers 12a, stress relaxing layers 12b, and barrier layers 12c. When the terminal sheet 10 is arranged between the semiconductor chip 20 and the circuit substrate 30 and a reflow is carried out, the adhesive layers 12a are joined with electrodes 21 of the semiconductor chip 20 and electrodes 31 of the circuit substrate 30, and the stress relaxing layers 12b contribute to relaxing the stress applied to the terminal sheet 10, while the barrier layers 12c contribute to maintaining shapes of the terminal parts 12 and inhibiting the adhesive layers 12a and the stress relaxing layers 12b from flowing out sideward. By this, a connection failure or short-circuit can be suppressed effectively. COPYRIGHT: (C)2009,JPO&INPIT
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