发明名称 FUNCTIONAL DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a functional device manufacturing method which improves manufacturing efficiency by shortening a step carrying-out time, brings about a compact space of a space portion, and contributes to reduction of variations of the shape of a functional structure and the space portion, to thereby achieve stabilization of device characteristics. SOLUTION: The functional device manufacturing method comprises: a functional structure forming step of forming the functional structure 15A via a sacrifice layer 14A on a substrate 11; a first release step of removing the sacrifice layer 14A and releasing the functional structure 15A; a protective material forming step of enclosing the functional structure 15A with a protective material 16 made of a material different from the sacrifice layer 14A, and protruding the protective material 16 upward from the periphery; a peripheral structure forming step of forming a peripheral structure P made of a material different from the protective material 16 around the protective material 16 to enclose the protective material 16; and a second release step of removing the protective material 16 to form the space portion. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009160686(A) 申请公布日期 2009.07.23
申请号 JP20080000378 申请日期 2008.01.07
申请人 SEIKO EPSON CORP 发明人 MORI TAKASHI;SATO AKIRA
分类号 B81C1/00 主分类号 B81C1/00
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