| 摘要 |
<p>The present invention relates to an installation method for a printed circuit board, comprising the steps of: applying solder cream to predetermined sites except for a site to be insulated on the lower surface of the board; mounting the board on the installation site of a housing where the said board is to be installed; and melting and hardening the solder cream on the lower surface of the board so as to fix and bond the board to the housing.</p> |
