| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve high transparency, thixotropy, and crack resistance at the same in a photosemiconductor package sealing resin material principally composed of a curable epoxy composition. <P>SOLUTION: This photosemiconductor package sealing resin material for sealing a photosemiconductor chip in a semiconductor package contains a heat curable epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is produced by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide to hydrophobize the smectite clay mineral. Bentonite, saponite, hectorite, vermiculite, stevensite, taeniolite, montmorillonite, or nontronite is quoted as the smectite clay mineral. <P>COPYRIGHT: (C)2009,JPO&INPIT |
