| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify manufacturing work of a multilayer printed wiring board, as well as reduce its manufacturing cost. <P>SOLUTION: The tip of each of conductive vias 25 of a pair of printed wiring boards 3A constituting an external layer is directed to the internal layer side, and the tip of the conductive via 25 facing the summit of an electronic part 7 is electrically connected with a connection terminal 15. The other tips of the respective conductive vias 25 are electrically connected with wiring patterns 21 of a printed wiring board 3 which are adjoining in the lamination direction, and the tips of the conductive vias 25, which correspond with at least one set of printed wiring boards 3B adjoining in the lamination direction, are fused to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT |
