| 摘要 |
PROBLEM TO BE SOLVED: To provide an expandable adhesive tape for improving cutting property of an adhesive tape, due to expanding, under a low temperature within a range of -15 to 5°C. SOLUTION: A tape for processing wafer includes an adhesive tape 10 having a base material sheet 11 and an adhesive layer 12. The tape is also provided with an adhesive film 13 arranged on the adhesive layer 12. The tape is used for cutting the adhesive film 13 corresponding to each chip by expanding the adhesive tape 10, under a low temperature within a range of -15 to 5°C. Peeling force of the adhesive tape 10 from the adhesive film 13 obtained in peeling test at 0±2°C is 0.2 N/25 mm or more. COPYRIGHT: (C)2009,JPO&INPIT
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