发明名称 HOUSED OBJECT CONVEYING SYSTEM
摘要 PROBLEM TO BE SOLVED: To reduce oxidized gas and releasing substance from an FFU, in a so-called conveying chamber of a semiconductor processing device in which an FIMS system is fixed. SOLUTION: The conveying chamber is separated into: a second chamber in which a conveying robot is arranged; and a minute first chamber including a door for holding a cover of a pod as the FIMS system. The second and first chambers are communicated by an opening part which can be opened and closed by a door. The second chamber is maintained in a state that the chamber is filled with high-purity nitride at a pressure higher than an inside of the first chamber by a small amount of nitride. The first chamber uses a downflow of a clean air through the FFU normally, and uses a downflow of nitride in conveying a wafer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009164369(A) 申请公布日期 2009.07.23
申请号 JP20080001036 申请日期 2008.01.08
申请人 TDK CORP 发明人 OKABE TSUTOMU;MIYAJIMA TOSHIHIKO
分类号 H01L21/677 主分类号 H01L21/677
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