| 摘要 |
PROBLEM TO BE SOLVED: To downsize a substrate, especially, a substrate on which substrate-side connection terminals to which connection terminals of a component are connected are formed. SOLUTION: The substrate as an embodiment of the present invention is a substrate having a mounting region where a component having the connection terminals is mounted and the connection terminals on the substrate side to which the terminals of the mounted component are connected when the component is mounted on the mounting region, the substrate having connection terminals formed in the rectangular mounting region on two adjacent sides. COPYRIGHT: (C)2009,JPO&INPIT
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