| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple wiring substrate having a reduced environmental load, and to provide a production process. SOLUTION: In a production process of a wiring substrate, a plastic substrate 1 is arranged below nozzles 3, and a mask 2 is arranged between the nozzles 3 and the plastic substrate 1 to cover the plastic substrate 1. The mask 2 is provided with slits in the same pattern as a desired wiring pattern. The nozzles 3 are moved in the direction of arrow A in Fig.1, and conductive powder 6 is sprayed from the nozzles 3. The conductive powder 6 thus sprayed passes through the slits of the mask 2, collides against the surface of the plastic substrate 1 and is bonded onto the substrate 1 by collision energy. Consequently, a wiring pattern is formed on the surface of the substrate 1. COPYRIGHT: (C)2009,JPO&INPIT
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