发明名称 THROUGH-TYPE MULTILAYER CAPACITOR ARRAY
摘要 PROBLEM TO BE SOLVED: To provide a through-type multilayer capacitor array capable of accurately managing the resistance value of resistance components. SOLUTION: The through-type multilayer capacitor array includes a capacitor body B1, and first and second signal terminal electrodes, disposed on the outer surface of the capacitor body, grounding terminals and first and second outer connection conductors. The capacitor body B1 has insulator layers 11-18; first signal inner electrodes 21, 22 connected to the first signal terminal electrode and the first outer connection conductor; second signal inner electrodes 41, 42 connected to the first outer connection conductor; third signal inner electrodes 31, 32 connected to the second signal terminal electrode and the second outer connection conductor; fourth signal inner electrodes 51, 52 connected to the second outer connection conductor; and grounding inner electrodes 61-63 connected to the grounding terminal electrode. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009164257(A) 申请公布日期 2009.07.23
申请号 JP20070340442 申请日期 2007.12.28
申请人 TDK CORP 发明人 TOGASHI MASAAKI
分类号 H01G4/35;H01G4/38 主分类号 H01G4/35
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