发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
A manufacturing method of a semiconductor device includes providing an adhesive on a supporting board, the supporting board being where a semiconductor element is to be mounted; providing a member configured to block flow of the adhesive on a first main surface of the semiconductor element, the semiconductor element having a second main surface where an outside connection terminal is provided; mounting the semiconductor element on a part of the supporting board where the adhesive is provided by pressing the semiconductor element via the member.
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申请公布号 |
US2009186451(A1) |
申请公布日期 |
2009.07.23 |
申请号 |
US20090408062 |
申请日期 |
2009.03.20 |
申请人 |
FUJITSU MICROELECTRONICS LIMITED |
发明人 |
TESHIROGI KAZUO;SHIMOBEPPU YUZO;YOSHIMOTO KAZUHIRO;SHINJO YOSHIAKI |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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