| 摘要 |
An electronic component module for mounting a semiconductor chip using a vacuum compression method and a mounting method thereof are provided to improve environmental problems related to harmful materials and to reduce a manufacturing cost by recycling electronic components disassembled in a scrapping process by using a vacuum compression method. An electronic component module for mounting a semiconductor chip using a vacuum compression method includes a printed circuit board(10), a semiconductor chip, and a cover(30). The printed circuit board includes one or more first contact part. The semiconductor chip has one or more second contact part. The semiconductor chip is aligned to connect electrically the second contact part with the first contact part of the printed circuit board. The semiconductor chip is loaded on the printed circuit board. The semiconductor chip has a predetermined shape of alignment. The cover is used for covering the semiconductor chip according to the shape of alignment. The semiconductor chip covered with the cover is aligned along the shape of alignment on the printed circuit board by using a vacuum compression method.
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