| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device sufficiently connecting electrically even to a small size element main body and capable of sufficiently taking out light even when a wiring layer is connected to the element main body, and to provide the manufacturing method of such a semiconductor light emitting device. <P>SOLUTION: A first conductive layer, a light emitting layer, and a second conductive layer having the type of conduction opposite to that of the first conductive layer and penetrating light emitted by the light emitting layer to the outside of the element, are laminated, while a metal layer for pouring a current for driving the semiconductor light emitting device is formed on the second conductive layer so as to be contacted with only the side surface of the second conductive layer. Even when the element is small and correct alignment is difficult, connection between the conductive layer and the metal layer is permitted easily and emitted light can be taken out while avoiding the shielding of a metal film or the like whereby the take-out efficiency of light can be improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
