| 摘要 |
The housing for an electronic equipment of the present invention contains a metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated. The preferable embodiments are the one in which an adhesive layer, a print layer, or both thereof is disposed between a resin layer contained in the resin film and the metal housing, the one in which the resin film contains at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA). |
