发明名称 Cooling subsystem with easily adjustable mounting assembly
摘要 An apparatus for mounting a motherboard includes a mounting boss and a boss backing. The mounting boss is alignable in a first orientation with a first hole spacing in the motherboard, and alignable in a second orientation with a second hole spacing in the motherboard. The boss backing is adapted to connect with the mounting boss in the first orientation through the motherboard having the first hole spacing, and adapted to connect with the mounting boss in the second orientation through the motherboard having the second hole spacing.
申请公布号 US7564683(B2) 申请公布日期 2009.07.21
申请号 US20070848048 申请日期 2007.08.30
申请人 DELL PRODUCTS, LP 发明人 HOOD, III CHARLES D.;SHEPHERD JASON A.
分类号 H05K5/00;F16B43/00 主分类号 H05K5/00
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