发明名称 |
Multiple wavelength sensor interconnect |
摘要 |
A sensor interconnect assembly has a circuit substrate. An emitter portion of the substrate is adapted to mount emitters. A detector portion of the substrate is adapted to mount a detector. A cable portion of the substrate is adapted to connect a sensor cable. A first group of conductors are disposed on the substrate electrically interconnecting the emitter portion and the cable portion. A second group of conductors are disposed on the substrate electrically interconnecting the detector portion and the cable portion. A decoupling portion of the substrate disposed proximate the cable portion substantially mechanically isolating the cable portion from both the emitter portion and the detector portion so that sensor cable stiffness is not translated to the emitters or the detector.
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申请公布号 |
US7563110(B2) |
申请公布日期 |
2009.07.21 |
申请号 |
US20080126702 |
申请日期 |
2008.05.23 |
申请人 |
MASIMO LABORATORIES, INC. |
发明人 |
AL-ALI AMMAR;ABDUL-HAFIZ YASSIR |
分类号 |
H01R12/00 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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