发明名称 Multiple wavelength sensor interconnect
摘要 A sensor interconnect assembly has a circuit substrate. An emitter portion of the substrate is adapted to mount emitters. A detector portion of the substrate is adapted to mount a detector. A cable portion of the substrate is adapted to connect a sensor cable. A first group of conductors are disposed on the substrate electrically interconnecting the emitter portion and the cable portion. A second group of conductors are disposed on the substrate electrically interconnecting the detector portion and the cable portion. A decoupling portion of the substrate disposed proximate the cable portion substantially mechanically isolating the cable portion from both the emitter portion and the detector portion so that sensor cable stiffness is not translated to the emitters or the detector.
申请公布号 US7563110(B2) 申请公布日期 2009.07.21
申请号 US20080126702 申请日期 2008.05.23
申请人 MASIMO LABORATORIES, INC. 发明人 AL-ALI AMMAR;ABDUL-HAFIZ YASSIR
分类号 H01R12/00 主分类号 H01R12/00
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