发明名称 Methods for packaging and sealing an integrated circuit die
摘要 A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.
申请公布号 US7563632(B2) 申请公布日期 2009.07.21
申请号 US20070980133 申请日期 2007.10.30
申请人 ANALOG DEVICES, INC. 发明人 MARTIN JOHN R.;ROBERTS CARL M.
分类号 H01L21/00;G01P1/02;H01L23/02 主分类号 H01L21/00
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