发明名称 |
Cleaning solution and cleaning method of a semiconductor device |
摘要 |
A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing foreign bodies from a surface of the semiconductor substrate. Accordingly, the foreign bodies can be substantially removed from the surface of the substrate without corroding a metal.
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申请公布号 |
US7562662(B2) |
申请公布日期 |
2009.07.21 |
申请号 |
US20070736260 |
申请日期 |
2007.04.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM SANG-YONG;CHOI SANG-JUN;HONG CHANG-KI |
分类号 |
B08B3/04;H01L21/304;B08B3/08;C11D1/00;C11D3/02;C11D3/24;C11D7/08;C11D11/00;C23F1/16;H01L21/02;H01L21/306;H01L21/3213;H01L21/768 |
主分类号 |
B08B3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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