Semiconductor integrated circuit for reducing number of contact pads to be probed in probe test

摘要

A semiconductor chip is composed of first and second contact pads; a first latch circuit connected with the first contact pad; a second latch circuit connected with the second contact pads; an internal circuit electrically connected with the first and second latch circuits; and a control circuit controlling data transfer between the first and second latch circuits. The area of the first contact pad is larger than that of the second contact pad.