BUMP STRUCTURE WITH MULTIPLE LAYERS AND METHOD OF MANUFACTURE

摘要

A bump structure with multiple layers and method of manufacture are provided to prevent spread of the adhesion material in a hermetic packaging process. The silicon layer is formed on the base substrate(11). In the protection substrate(16) for sealing up the base substrate, the first layer(15) is formed to separate the base substrate from the protection substrate. The second layer(14) for eutectic bonding with the base substrate is formed on the first layer. The second layer is bonded with base substrate by the eutectic bonding. The first layer has the melting point higher than the eutectic temperature of the base substrate and the second level.