| 摘要 |
Disclosed is a resin composition having low thermal expansion, which enables to form a plated conductive layer with sufficient adhesion strength, while suppressing roughness of an insulating layer surface (namely, ensuring low surface roughness of an insulating layer) during a wet roughening process. Specifically disclosed is a resin composition characterized by containing a cyanate ester resin and a naphthol epoxy resin represented by the following formula (1). (In the formula, n represents a number having an average of 1-6; X represents a glycidyl group or a hydrocarbon group having 1-8 carbon atoms; and the ratio of hydrocarbon group/glycidyl group is within the range of 0.05-2.0.) |
