发明名称 Circuit wiring layout in semiconductor memory device and layout method
摘要 An improved circuit wiring layout provides smooth circuit wiring in a peripheral circuit region adjacent to a memory cell region of a semiconductor memory device, and eliminates a write-speed limiting factor. Forming a metal (instead of a metal silicided polysilicon) wiring layer to be connected to a gate layer, to transmit an electrical signal to the gates of FET (e.g., MOSFET (Metal Oxide Semiconductor Field Effect Transistor) transistors formed in the peripheral circuit region; the metal wiring layer is formed (e.g., using one metal damascene process), on a layer different from a word line layer formed on the gate layer (e.g., using another metal damascene process), thereby obtaining a layout of a peripheral circuit region having a reduced area and without using a silicide process.
申请公布号 US7564134(B2) 申请公布日期 2009.07.21
申请号 US20050259401 申请日期 2005.10.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YANG HYANG-JA;LEE SONG-JA
分类号 H01L23/48;G01L5/06;H01L23/52;H01L29/40 主分类号 H01L23/48
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