PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

A printed circuit board and semiconductor package using the same are provided to prevent pore generated between adhesive tape and solder resist and avoid fault by expansion of pore. A base board(100) has a conductive pattern(200) containing a bond finger part(210). The base board has outer area placed at inner area and outer area containing semiconductor chip adhesive unit. The first resist(310) is formed at conductive pattern of inner area in base board upper side. The solder resist(320) is formed at conductive pattern of outer area in base board upper side.