PREPREG AND THE APPLIED PRODUCTS FOR LOW THERMAL EXPANSION AND LOW DIELECTRIC LOSS

摘要

A prepreg, a layered plate using the prepreg, and a printed wiring board using the prepreg are provided to obtain the cured product having a low thermal expansion and a low dielectric loss with inhibiting the deterioration of cost and processability. A prepreg is a composite of the fabric or nonwoven comprising a glass fiber and an olefin fiber as a main component and 45 ~ 98 weight% of a thermosetting low thermal expanding resin composition, wherein the cured product of the low thermal expanding resin composition has a thermal expansion coefficient of 50 ppm/°C or less at 50 ~ 100 °C. The fabric or nonwoven comprises 40 ~ 60 weight% of a glass fiber and 40 ~ 60 weight% of an olefin fiber.