| 摘要 |
A substrate processing apparatus is provided to suppress exposure of a plasma electrode at an atmospheric state by positioning the plasma electrode in an inside of a reactive space and insulating electrically the plasma electrode and the reactive space from each other. A substrate processing apparatus(110) includes a chamber(112), a plasma electrode(118), and a substrate loading plate(122). The chamber includes a reactive space which is insulated from the outside. The reactive space is used for maintaining a state of vacuum. The plasma electrode is installed in the inside of the reactive space. The plasma electrode is insulated from the chamber. The substrate loading plate is used as an opposite electrode of the plasma electrode. A substrate(120) is loaded on the substrate loading plate.
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