| 摘要 |
A condenser microphone minimizes the whole thickness of the condenser microphone by inserting circuit elements into a cavity formed on a predetermined region of a PCB. An MEMS(Micro Electro Mechanical System) chip converts a sound into an electrical signal. A semiconductor chip processes the electrical signal converted in the MEMS chip. A substrate includes a hole etched with a predetermined depth into which the MEMS chip(50) and the semiconductor chip are inserted. A sound hole to which the sound is inputted is formed in a case(20). The case is assembled with the substrate.
|
