| 摘要 |
<p>An object is to provide a cured product having excellent properties including electrical insulating properties, heat-impact resistance and adhesion properties. Another object is to provide a photosensitive insulation resin composition which can be formed into the cured product and can be suitably used in an interlayer insulation film or a surface-protecting film for a semiconductor element or the like. The photosensitive insulation resin composition comprises: (A) a copolymer comprising 10-99 mol% of a constitutional unit (A1) represented by the formula (1) and 90-1 mol% of a constitutional unit (A2) represented by the formula (2) (provided that the sum total of all of constitutional units of the copolymer (A) is defined as 100 mol%); (B) a compound (B1) having an oxetanyl group; (C) a photosensitive acid generator; (D) a solvent; and (F) a crosslinked microparticle. (1) (2) wherein R1 represents an alkyl or alkoxy group having 1 to 4 carbon atoms, or an aryl group; R2 represents a hydrogen atom or a methyl group; m represents an integer ranging from 1 to 3; n represents an integer ranging from 0 to 3, provided that m and n satisfy the following formula: m+n<=5; R3 represents an alkyl or alkoxy group having 1 to 4 carbon atoms, or an aryl group; R4 represents a hydrogen atom or a methyl group; and k represents an integer ranging from 0 to 3.</p> |
