发明名称 SUBSTRATE STRIP
摘要 A substrate strip is provided to reduce a manufacturing cost by changing the material forming a coating layer of a mold gate. A substrate strip includes an insulator(10) of a plate shape, a plurality of unit patterns formed in one side of the insulator, a mold gate(30) of a concave shape formed in one side of the insulator, and a coating layer(43) formed in the surface of the mold case. The coating layer includes at least one selected among a group composed of OSP(Organic Solderability Preservative), aluminum, nickel, palladium, gold, and copper. The manufacturing cost is reduce by forming the coating layer made of OSP on a surface of the mold gate.
申请公布号 KR20090054791(A) 申请公布日期 2009.06.01
申请号 KR20070121652 申请日期 2007.11.27
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KANG, TAE HYEOG;CHOI, BONG KYU
分类号 H01L23/538 主分类号 H01L23/538
代理机构 代理人
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