| 摘要 |
<p>A method for cutting a protective tape of a semiconductor wafer and an apparatus thereof are provided to cut a protective tape while removing dust generated by a tape cutting. A cutter blade(12) is moved according to a circumference of a semiconductor wafer. Dust is generated in a tape cutting part by a cutter blade, and is attached on a top surface of a protective tape. A dust collection member(56) is moved together with the cutter blade, and collects the dust. After finishing a tape cutting, the dust collected in a fixed part of the dust collection member is absorbed and is removed in an absorption device. The dust collection member is a brush. The brush collects the dust. While the brush is separated from the semiconductor wafer, an air blow is performed toward the brush and the dust from an air nozzle.</p> |
