| 摘要 |
A SOLDER PREFORM HAVING MULTIPLE LAYERS INCLUDING A SOLDER LAYER FILLED WITH ADDITIVES INTERPOSED BETWEEN TWO UNFILLED LAYERS FOR IMPROVED WETTABILITY. A SOLDER PREFORM HAVING A SPHERE WHICH CONTAINS A SOLDER MATERIAL FILLED WITH ADDITIVES, AND AN UNFILLED SURFACE LAYER FOR IMPROVED WETTABILITY. AMONG THE FILLERS ARE CTE MODIFYING COMPONENTS AND/OR THERMAL CONDUCTIVITY ENCHANCEMENT COMPONENTS. AN ACTIVE SOLDER CONTAINING A SOLDER METAL BONDING COMPONENT AND AN INSTRINSIC OXYGEN GETTER.
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