MOLDING APPARATUS AND MOLDING PROCESS UTILIZING THE SAME

摘要

A PROCESS AND AN APPARATUS FOR MOLDING, IN WHICH A MOLTEN THERMOPLASTIC RESIN IS FIRMLY FITTED ONTO A MOLDING SURFACE OF A MOLD UNDER A PRESSURE LOWER THAN OR EQUAL TO 100 KG/CM2 AND IS CURED TO OBTAIN A MOLDED PRODUCT. THE MOLDING APPARATUS HAS A MOLD MAIN BODY, AND A MOLD BODY ON WHICH THE MOLDING SURFACE IS DEFINED. THE MOLD BODY IS SUPPORTED RELATIVE TO THE MOLD MAIN BODY WITH MAINTAINING A SPACE ON THE BACK SIDE OF THE MOLDING SURFACE IN A HEAT INSULATIVE MANNER BY A SUPPORTING MEMBER WHICH INCLUDES AT LEAST A HEAT INSULATIVE SUPPORTING MEMBER HAVING A THERMAL CONDUCTIVITY OF 0.001 TO 1 KCAL/MH °C AND A LONGITUDINAL ELASTIC MODULUS OF 0.01 TO 10 KG/CM2. IN THE SPACE, A HEATING FLUID FOR HEATING THE MOLDING SURFACE FROM THE BASK SIDE TO A TEMPERATURE HIGHER THAN OR EQUAL TO VICAT SOFTENING TEMPERATURE (T) °C OF THE THERMOPLASTIC RESIN AND A COOLING FLUID FOR COOLING THE MOLDING SURFACE FROM THE BACK SIDE TO A TEMPERATURE LOWER THAN OR EQUAL TO (VICAT SOFTENING TEMPERATURE (T) OF THE THERMOPLASTIC RESIN - 10) °C ARE SUPPLIED.