发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ARRAY OF EXTERNAL INTERCONNECTS |
摘要 |
An integrated circuit package system includes: forming an array of external interconnects with an intersecting region between the external interconnects; removing the intersecting region for forming an isolation hole between the external interconnects; mounting an integrated circuit die over the external interconnects; connecting an internal interconnect between the integrated circuit die and the external interconnects; and forming a package encapsulation over the integrated circuit die with the external interconnects partially exposed. (Fig. 1) |
申请公布号 |
SG152140(A1) |
申请公布日期 |
2009.05.29 |
申请号 |
SG20080071839 |
申请日期 |
2008.09.25 |
申请人 |
STATS CHIPPAC LTD |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ADVINCULA ABELARDO JR. HADAP;TAY LIONEL CHIEN HUI |
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